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[软件工程] HADOOP_Full
说明:HADOOP presentation will open some important things about the platform.<Sima> 在 2025-11-05 上传 | 大小:196kb | 下载:0
[文档资料] JackC_translated
说明:高密度互連技術導孔結構對印刷電路板設計彈性,約束條件,以及成本的影響-High-density interconnect technology pilot hole structure on the printed circuit board design flexibility, constraints, and cost of<Dean> 在 2025-11-05 上传 | 大小:1009kb | 下载:0
[文档资料] si_seminar_sept2006_vna_crosstalk
说明:Minimizing Crosstalk in High Speed Interconnects using Measurement-based ModelingMinimizing Modeling<Dean> 在 2025-11-05 上传 | 大小:1.08mb | 下载:0
[软件工程] SoftwareEngg
说明:softengg has files about an assignment i did in the fall of 2008 and some ppt presentations i utilised in the seminar .<nats> 在 2025-11-05 上传 | 大小:99kb | 下载:0
[软件工程] SoftwareEngg1
说明:softengg has files about an assignment i did in the fall of 2008 and some ppt presentations i utilised in the seminar no 2.-softengg has files about an assignment i did in the fall of 2008 and some ppt presentations i utilised in the seminar no 2.<nats> 在 2025-11-05 上传 | 大小:132kb | 下载:0
[软件工程] SoftwareEngg2
说明:softengg has files about an assignment i did in the fall of 2008 and some ppt presentations i utilised in the seminar .<nats> 在 2025-11-05 上传 | 大小:59kb | 下载:0
[软件工程] SoftwareEngg3
说明:softengg has files about an assignment i did in the fall of 2008 and some ppt presentations i utilised in the seminar .<nats> 在 2025-11-05 上传 | 大小:14kb | 下载:0
[软件工程] SoftwareEngg4
说明:softengg has files about an assignment i did in the fall of 2008 and some ppt presentations i utilised in the seminar .<nats> 在 2025-11-05 上传 | 大小:35kb | 下载:0