球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以代替引脚，在印刷基板的正面装配LSI芯片，然后用模压树脂或灌封方法进行密封。-Spherical contact on display, one of surface mount package. In the back of the printed substrate produced by the display means to replace the pin ball bump, substrate in th