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  1. bou-melhem

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  2. The trend of miniaturization in electronics has led to greater heat densities within computer chips, demanding high performance heat sinks at smaller and smaller scales. The equation used within VI program is used to calculate the resistance of the
  3. 所属分类:LabView

    • 发布日期:2025-06-20
    • 文件大小:54272

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