搜索资源列表
TMS320F2812
- F2812的原理图和芯片封装,方便开发人员制版!
简谈半导体集成电路封装的历程
- 详细地列举了芯片封装的发展历史。可作趣味性了解。-detailed list of chip packaging development history. For fun understanding.
c51
- 32*64led点阵,使用74hc595串行转并行的芯片,采用led点阵显示数据
简谈半导体集成电路封装的历程
- 详细地列举了芯片封装的发展历史。可作趣味性了解。-detailed list of chip packaging development history. For fun understanding.
arm_pcb
- 包括ARM7芯片44B0开发板上所需芯片的所有SCH和PCB的封装,就算按钮和电容电阻都有。-including ARM7 chip 44B0 development board for all the chips SCH and PCB package, even if the button is resistance and capacitance.
TMS320F2812
- F2812的原理图和芯片封装,方便开发人员制版!-F2812 schematic and the chip package to facilitate the development of staff plate!
nRF905
- 无线收发芯片nRF905的封装库,封装格式比较特殊,自己画比较困难-Wireless transceiver chip nRF905 package database, package format rather special, more difficult to draw their own
CPU
- Intel的并不是在一个芯片上集成四个硬件核心,而是采用双芯片的组合方式,Intel只需要生产双核Core 2 Duo处理器,然后再将芯片封装在一起,成为四核心的Core 2 Quad。不过,Core 2 Quad 双芯片四核设计存在问题,虽然Core 2 Duo芯片内部的双核心可以共享二级缓存,具有较高的协作效率-Intel is not in a hardware chip four-core, instead of using t
chip_type
- 芯片封装类型介绍,内含封装类型图片,是比较全面的介绍-Chip package types, the package containing the type of picture, a more comprehensive presentation
TMS320LF2407
- TMS320LF2407芯片封装库,用于TMS320LF2407电路protel设计-TMS320LF2407 chip package library for TMS320LF2407 Protel circuit design
largestm32evlpcb
- STM32 144管脚芯片封装,难得的技术资料-STM32 144-pin chip package, a rare technical information
somuchfootprintpic
- 汗多的芯片封装介绍,在必要的时候可以查阅-Khan, introduced the multi-chip package, when necessary, can be found
yuanjianfengzhuang
- 常用元器件封装及标准技术资料,包含二极管 三极管、稳压芯片、成电路封装,三极管的检测方法与经验等 -Common components and standard technical data package, including diode transistor, voltage regulator chip, into a circuit package, transistor test methods and experie
tongyongfengzhuang
- 通用封装库,收集了半年的东西。altium designer 大家都用的元件,,蜂鸣器,数码管,芯片都能找到。-General package library to collect things for half a year. altium designer we all used components, buzzer, digital control, the chip can be found.
DS18B20[1]
- 该产品采用美国DALLAS公司生产的 DS18B20可组网数字温度传感器芯片封装而成,具有耐磨耐碰,体积小,使用方便,封装形式多样,适用于各种狭小空间设备数字测温和控制领域。-The product produced by the United States DS18B20 DALLAS Network digital temperature sensor chip can be packaged together, with wear
ds18b20
- 采用美国DALLAS公司生产的 DS18B20可组网数字温度传感器芯片封装-DALLAS produced by the United States can DS18B20 digital temperature sensor chip package Network
比较全的ALTERA芯片的原理图和封装库
- 比较全的ALTERA芯片的原理图和封装库(Comparison of the ALTERA chip schematic and package library)
芯片手册
- 芯片,英文为Chip;芯片组为Chipset。芯片一般是指集成电路的载体,也是集成电路经过设计、制造、封装、测试后的结果,通常是一个可以立即使用的独立的整体。“芯片”和“集成电路”这两个词经常混着使用,比如在大家平常讨论话题中,集成电路设计和芯片设计说的是一个意思,芯片行业、集成电路行业、IC行业往往也是一个意思。实际(Chip, chip for chip in Chipset. Chip generally refers to th
QFN封装库全集 (protel封装)
- QFN库,AD库,可直接使用的芯片封装库(QFN library,AD library)
DIP芯片缺陷检测--程序
- DIP芯片缺陷检测--程序DIP封装芯片管脚缺陷检测技术研究(1)(DIP Chip Defect Detection--Program)